Resistor
Thin film Precision resistor 0.01%, TC2ppm, wirebondale, Anti-Crossive, MELF. Current sensing, Metal...
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SMD INDUCTOR
| AL | A Photo Lithographic single layer inductor, Stable inductance in high frequency circuit. Tight tolerance of ±1%,±2% or ±0.1nH, Miniature size of 0201/0402/0603, High SRF, Excellent Q Application: Cell phone, Pager, Wireless LAN, GPS, VCO, TCXO Circuit , RF transceiver module, Bluetooth module, High Frequency Communication Applications |
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| WL | Miniature wire wound chip inductor for fully automated assembly. Wire-wound ceramic construction providing high self resonant frequency and superior high Q, stable solderability. Complete size for 0402/0603/0805/1008/1206, Tight tolerance of ±2%,5%,10% Application: Cell phone (CDMA/GSM/PHS), Wireless PDA, Cordless Phone (DECT/CT1/CT2), Remote Control , Security System, Wireless Lan/ Mouse/Keyboard, Earphone, VCO, RF Module Base Station, Repeater, GPS Receiver, High Frequency Communication Applications, Broad Band- CATV Filter, Tuner, Set Top Box, IT Applications-USB2.0, IEEE1394. |
| CL-S | SMD Multi- layered chip inductor provided cost efficient in large production, High Q, High SRF, Wide inductance range, Tight tolerance of ±5%,±10% or ±0.3nH, Miniature size of 0201/0402/0603/0805 Application: Cell phone, Pager, EMI Countermeasure in RF circuit , High Frequency Communication Applications |
| NL | Ferrite Wirewound Chip inductor, size of 0805/1008/1210/1812/2220 , Both pen and molded types are available, Large current support. These revolutionary, highly reliable wound chip inductors for automatic mounting, have been developed in response to the trend toward high density in electronic equipment. With metal terminals and a body of heat resistant resin, these inductors offer strong solderability , Highly accurate dimensions, can be mounted automatically, Super Q Characteristics. Application: Micro Televisions, Liquid Crystal Televisions, Video Cameras, Portable VCRs, Car Radios, Car Stereos, Thin Tape Radios, Television Tuners, Mobile Telephones, Radio and Other Electronic Devices. |
| Power Inductor | Complete sizes and different material for different application need. High current, Low RDC, Compact, Low profile, Shielded and Un-shielded available, Miniature chip inductor wound on special ferrite cores. Application: Pagers, Cell phone, PC, Laptop, DC-DC Converter, DC Power Supply, LCD TV, MP# Player, PGS, PDA, CDR-W, Digital Camera, Power Supplier for VTRs, QA Equipment |
| CM | Small Chip Inductor with Ferrite Core and Two Line Types Wire wound. Highly Effective in Noise Suppression. High Common-mode Impedance at Noise Band and Low Differential-Mode Impedance at Signal Band. Application: EMI Radiation Noise Suppression for Any Electronic Device. USB Line for Personal Computers and Peripheral. IEEE 1394 Line for Personal Computers ,DVC,STB. LCD Panels. Low-Voltage Differential Signal (LVDS), |
| CB | SMD Multi-layered Chip bead provide a cost effective solution for wide applications in EMI Countermeasure. General use, high power is available. Application: Computers and Computer Peripherals, Digital Cameras, Digital Televisions |
CHIP RESISTOR
| AR | Thin Film Passivated NiCr Resistor with Very tight tolerance ±0.01%, 0.05%,0.1%,0.25%,0.5%, 1%, Extremely low TCR 5,10,15,25,50ppm/℃, Wide R-Value range for 1ohm~3Mohm, Complete size of 0201/0402/0603/0805/1206/2010/2512. Application: Automotive , Motherboard, Industrial equipment, Automatic equipment controller, Medical equipment, Telecom Device, Testing/Measurement equipment, Converter, Cell phone |
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| PR | Special Passivated NiCr Film for Anti-Acid and Anti-Damp. Stable performance at moisture receptivity, Guarantee long term life stability and demonstrated the Anti-Corrosion claims Characterized by Tantalum. Application: Automotive , Motherboard, Industrial equipment, Automatic equipment controller, Medical equipment, Telecom Device, Testing/Measurement equipment, Converter, Cell phone |
| CSR | SMD type, Advanced thin film technology. Excellent overall stability: Class 0.25. Force fitted steel caps, tin plated on nickel barrier. Pure Sn termination on Ni barrier layer. Provided 0204,0207 , tight tolerance of 0.1%,0 .5%,1%, TC10,15,25,50 ppm/℃ Application: Military, Automotive, Telecommunication, Medical equipment, Avionics, Space |
| MFR | Leaded type, Advanced thin film technology. Excellent overall stability. Very Tight Tolerance from ±0.1%,0.25%,0.5%,1%,Extremely Low TCR from ±15,25,50,100PPM/℃ Application: Military, Automotive, Telecommunication, Medical equipment, Avionics, Space |
| CS | Thick Film process for low TCR 100ppm/℃, 3W in 1225 package size, Very low ohm from 1mohm-1000mohm, High purity alumina substrate for high power dissipation, Complete size of 0201/0402/0603/0805/1206/2010/2512/3720/7520/1225 Application: Power Management , Switching power supply, Voltage Regulation Module, DC-DC converter, Battery pack, Charger, Adaptor, Automotive engine control, Disk driver, PDA, Cell phone |
| TCS | Thin Film process for very tight tolerance of ±0.5%,1%,5% , low TCR 50,100ppm/℃, 3W in 2512 package size, Very low ohm from 1mohm-1000mohm, High purity alumina substrate for high power dissipation, High reliability, stability. Application: Power Management , Switching power supply, Voltage Regulation Module, DC-DC converter, Battery pack, Charger, Adaptor, Automotive engine control, Disk driver, PDA, Cell phone |
| LR | High Wattage rating up to 3W, Low TC 50,100ppm/℃, Ultra low ohm from 0.5m to 22mohm, Tolerance of ±1%,5%. Without laser trimmed with very low inductance, Customized resistance is available Application: Notebook/Mother board/Monitor for power management, DC-DC converter, Charger, Adaptor |
| TR | TO-220 package 20W/30W/35W/50W at 25/℃ Case temperature heat sink mounted, Molded case for protection and easy to mount, non inductive. Application: Gate Resistors in power supplier, Snubbers, Load and dumping resistor in CRT monitor, Terminal resistance in RF power amplifiers, Voltage Regulation, UPS |
CHIP CAPACITOR
THIN FILM CHIP CAPACITOR
Thin film process in Silicon capacitor offers high precision and stable, High Q , Low TCC, Available on MIM or MIS structures, The MIS capacitors provide top and bottom contact, and MIM capacitors have both terminals on top of silicon substrate. Customized spec is upon request.
Application:
Miniaturization module and Hybrid Circuits, Smart card, RFID.
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